Silicon Wafer Preparation Lapper from China
A lapping machine that grinds silicon wafers to tight flatness tolerances before fabrication processing. It is critical for achieving precise wafer surfaces, qualifying as a grinding machine for solid mineral substances.
Duty Rate — China → Canada
0%
Import Tips
• Clarify that lapping is a grinding process for mineral wafers, not a polishing machine of heading 84.67
• Provide technical specifications to CBSA showing the lapping function
• Verify if the machine is eligible for duty relief under the Machinery Program