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boule Crystal Diameter Grinder

An automated grinder designed to shape semiconductor boules to uniform diameter specifications, ensuring consistent wafer yield. It processes solid mineral substances such as silicon crystals, which falls under the scope of crushing or grinding machines for mineral materials.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
🇨🇳ChinaFree—Free
🇲🇽MexicoFree—Free
🇺🇸United StatesFree—Free
🇩🇪GermanyFree—Free
🇯🇵JapanFree—Free

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.20.00Same rate: Free

If the grinder is specifically designed for semiconductor device manufacturing

Machines solely or principally used for semiconductor manufacture are classified in heading 84.86.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Ensure the grinder is classified as a machine for grinding solid mineral substances, not as semiconductor manufacturing equipment (heading 84.86)

• Provide a detailed technical description and intended use to CBSA to avoid reclassification

• Verify if the grinder qualifies for duty relief under any free trade agreements

Related Products under Tariff item 8474.20.00

Crystal Ingot Slicing Pre-Grinder

A pre-grinding machine that prepares silicon ingots before multi-wire saw slicing into wafers. It ensures uniform slicing and higher wafer quality by grinding the solid mineral ingot, fitting the definition of a grinding machine for mineral substances.

Czochralski Crystal Puller Grinder

A precision grinding machine used to grind semiconductor crystal boules produced by the Czochralski method to exact diameters for wafer slicing. It processes solid mineral substances, qualifying as a grinding machine under this tariff item.

Diamond Wafer Grinding Machine

A high-precision grinder using diamond abrasives for initial silicon wafer backgrinding, reducing wafer thickness from 700μm to less than 100μm. It grinds solid mineral wafers, fitting the scope of grinding machines for mineral substances.

Float Zone Crystal Boule Grinder

A grinding apparatus for float zone monocrystalline semiconductor boules, creating precise flats indicating resistivity. It grinds solid mineral substances, qualifying as a grinding machine under this tariff item.

Gallium Arsenide Crystal Grinder

A specialized grinder for gallium arsenide compound semiconductor boules, grinding to precise diameters and flats. It processes solid mineral substances, fitting the definition of a grinding machine for minerals.

Handheld Portable Ore Grinder

A battery-powered handheld grinder for small-scale mineral ore sample crushing in field geology. It is a portable grinding machine for solid minerals, fitting the scope of this tariff item.