Wafer Polishing Head Assembly
A wafer polishing head assembly is a multi-head polishing assembly that holds and rotates semiconductor wafers against polishing pads to achieve mirror-finish surfaces. It is critical for producing defect-free wafers for semiconductor fabrication. This assembly is equally suitable for use with machines of headings 84.70 to 84.72, supporting various wafer polishing functions.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the assembly is solely or principally used in machines for manufacturing semiconductors
Parts of machines for the manufacture of semiconductor devices are classified under heading 84.86.
If the assembly is a part of a machine-tool of heading 84.56 to 84.65
Parts and accessories for machine-tools are classified under heading 84.66 when suitable for use with those machines.
If the assembly is part of a machine with a specific function not covered elsewhere
Machines having individual functions not specified elsewhere are classified under heading 84.79.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify this assembly as a part of semiconductor processing equipment, not as a general machine tool part
• Provide technical documentation showing its principal use in wafer polishing machines
• Verify if the assembly qualifies for duty-free import under the Customs Tariff's provisions for semiconductor manufacturing equipment
Related Products under Tariff item 8473.50.90
Boule Flattening Grinder Wheel
A boule flattening grinder wheel is a diamond-impregnated wheel used to grind flats on semiconductor crystal boules, indicating resistivity and conductivity type. It is designed for use with crystal preparation equipment that processes semiconductor materials for later fabrication. This wheel is equally suitable for use with machines of headings 84.70 to 84.72, as it supports the preparation of components for ADP systems.
Crystal Boule Grinder Spindle Assembly
A crystal boule grinder spindle assembly is a rotating spindle unit used in crystal grinders to shape semiconductor boules to exact wafer diameters and grind orientation flats. It is a critical component of semiconductor processing machines that prepare materials for ADP systems. This assembly is equally suitable for use with machines of headings 84.70 to 84.72, supporting various wafer preparation functions.
Crystal Growth Crucible Holder
A crystal growth crucible holder is a high-temperature-resistant holder designed to secure quartz crucibles in Czochralski silicon crystal pullers. It maintains crucible alignment and temperature stability during the crystal growth process, which is essential for producing semiconductor-grade silicon. This holder is equally suitable for use with machines of headings 84.70 to 84.72, as it supports the preparation of components for ADP systems.
Czochralski Crystal Puller Mechanism
A Czochralski crystal puller mechanism is a precision-engineered pulling mechanism used in crystal growers to produce monocrystalline silicon boules for semiconductor wafers. It is a key part of semiconductor manufacturing equipment that prepares materials for ADP systems. This mechanism is equally suitable for use with machines of headings 84.70 to 84.72, supporting various crystal growth functions.
Float Zone Crystal Furnace RF Coil
A float zone crystal furnace RF coil is a radio frequency induction coil used in float zone crystal growth furnaces to melt and purify semiconductor material without crucibles. It enables precise heating and zone refining, essential for producing high-purity silicon. This coil is equally suitable for use with machines of headings 84.70 to 84.72, as it supports semiconductor material preparation for ADP systems.
PCI Express Backplane Connector
A PCI Express backplane connector is a high-speed interconnect used to link printed circuit assemblies (PCAs) to backplanes in servers and computing systems. It ensures reliable data transmission between PCAs and other system components, making it an essential part for automatic data processing machines of heading 84.71. This connector is equally suitable for use with machines of headings 84.70 to 84.72, hence its classification under tariff item 8473.50.90.