3DS Stacked 16GB HBM2 Memory Module
A 16GB High Bandwidth Memory 2 (HBM2) module using 3D stacking technology, designed for AI accelerators and high-performance workstations. It is a printed circuit assembly that provides high-speed data transfer for compute-intensive applications.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the module is presented as a printed circuit assembly for a specific machine
This alternative applies when the HBM2 module is considered a printed circuit assembly, which is a sibling tariff item.
If the module is imported as part of a complete processing unit
If the HBM2 module is integrated into a processing unit, it may be classified under the unit's heading.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the HBM2 module is declared as a part of an automatic data processing machine under heading 8471
• Verify the country of origin to determine applicable preferential tariff treatments under Canada's trade agreements
• Keep documentation of the module's technical specifications to support classification
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