3DS Stacked 16GB HBM2 Memory Module from Germany
A 16GB High Bandwidth Memory 2 (HBM2) module using 3D stacking technology, designed for AI accelerators and high-performance workstations. It is a printed circuit assembly that provides high-speed data transfer for compute-intensive applications.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the HBM2 module is declared as a part of an automatic data processing machine under heading 8471
• Verify the country of origin to determine applicable preferential tariff treatments under Canada's trade agreements
• Keep documentation of the module's technical specifications to support classification