Gallium Arsenide Wafer Paring Tool
A gallium arsenide wafer paring tool that trims compound semiconductor wafers to exact dimensions after slicing. This precision machine handles brittle materials and ensures wafers meet strict dimensional tolerances for electronic applications.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is solely or principally used for semiconductor manufacture
Heading 84.86 takes precedence for machines used in semiconductor manufacturing.
If the machine works on materials like stone or ceramics
Heading 84.64 covers machine-tools for working stone, ceramics, and similar materials.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the machine is classified as a machine-tool for working hard materials, not as semiconductor manufacturing equipment under heading 84.86
• Have the machine's specifications and the material it processes documented for CBSA
• Check if the machine qualifies for duty reduction under a trade agreement
Related Products under Tariff item 8465.96.00
Chemical Mechanical Wafer Polisher
A chemical mechanical wafer polisher uses chemical slurry and mechanical pad to achieve atomic-level flatness on semiconductor wafers for device fabrication. It is classified under tariff item 8465.96.00 as a paring machine for hard materials, including semiconductor materials.
Commercial 30-Ton PTO Log Splitter
A professional-grade log splitter driven by tractor PTO with 30 tons of force for high-volume firewood production. It falls under this tariff item as a splitting machine for woodworking, specifically designed to split logs along the grain.
Crystal Boule Diameter Grinder
A crystal boule diameter grinder that grinds semiconductor crystal boules to precise diameter tolerances before slicing. This machine also creates orientation flats, which are essential for subsequent wafer processing steps.
Crystal Boule Grinder
A crystal boule grinder that grinds semiconductor crystal boules to exact diameters and creates flats indicating conductivity type and resistivity. This machine is critical for preparing boules for wafer slicing in semiconductor manufacturing.
Crystal Boule Slicing Machine
A high-precision machine that uses diamond wire or blades to slice semiconductor boules into individual wafers for device fabrication. It falls under this tariff item as a slicing machine specifically designed for hard materials like silicon, which are similar to hard plastics or hard rubber.
Crystal boule Slicing Multi-Wire Saw
A crystal boule slicing multi-wire saw uses hundreds of diamond wires to simultaneously slice an entire boule into hundreds of wafers, maximizing yield. It is classified under tariff item 8465.96.00 as a slicing machine for hard materials, including semiconductor materials.