Double-Sided Wafer Polisher
A numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for polishing, and is numerically controlled.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is primarily for gear grinding or gear finishing
Heading 8461 includes gear grinding machines; if the machine is used for gear grinding, this subheading may apply.
If the machine is not numerically controlled
This sibling item covers other machine-tools in the same subheading that are not numerically controlled.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide technical documentation showing the machine's polishing function and numerical control
• If the machine uses chemical-mechanical planarization, verify if it qualifies for any duty relief programs
• Keep accurate records of the machine's origin and value for customs purposes
Related Products under Tariff item 8461.90.10
Chevalier FSG-ADV1600 CNC Grinder
The Chevalier FSG-ADV1600 is a numerically controlled double-column surface grinder engineered for precision finishing of large metal baseplates used in semiconductor cleanroom equipment. It removes material from metal or cermet workpieces to achieve the flatness tolerances critical for wafer processing environments. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
CNC Broaching Machine for Wafer Chucks
A numerically controlled broaching machine that cuts precise keyways and slots in semiconductor wafer chucks for vacuum or electrostatic holding. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for broaching, and is numerically controlled.
CNC Shaping Machine for Wafer Carriers
A numerically controlled shaping machine that forms custom profiles on semiconductor wafer carriers and boats for cleanroom transport. This machine works by removing metal or cermets and is classified under 8461.90.10 as it is a shaping machine-tool that is numerically controlled.
CNC Slotter for Wafer Test Probes
A numerically controlled slotting machine that cuts precise grooves in probe cards and contacts for semiconductor wafer testing interfaces. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for slotting, and is numerically controlled.
CNC Wafer Edge Profiling Grinder
A numerically controlled edge grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. This machine works by removing material from semiconductor wafers and is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for grinding, and is numerically controlled.
Crystal Boule Grinder
A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity. It is classified under 8461.90.10 as a numerically controlled machine-tool working by removing metal or cermets, specifically for grinding.