Double-Sided Wafer Polisher from Japan
A numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for polishing, and is numerically controlled.
Duty Rate — Japan → Canada
0%
Import Tips
• Provide technical documentation showing the machine's polishing function and numerical control
• If the machine uses chemical-mechanical planarization, verify if it qualifies for any duty relief programs
• Keep accurate records of the machine's origin and value for customs purposes