Numerically controlled
Machine-tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine-tools working by removing metal, or cermets, not elsewhere specified or included. > Other > Numerically controlled > Numerically controlled
Duty Rate (from China)
Products classified under Tariff item 8461.90.10.00
Chevalier FSG-ADV1600 CNC Grinder
The Chevalier FSG-ADV1600 is a numerically controlled double-column surface grinder engineered for precision finishing of large metal baseplates used in semiconductor cleanroom equipment. It removes material from metal or cermet workpieces to achieve the flatness tolerances critical for wafer processing environments. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10CNC Broaching Machine for Wafer Chucks
A numerically controlled broaching machine that cuts precise keyways and slots in semiconductor wafer chucks for vacuum or electrostatic holding. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for broaching, and is numerically controlled.
8461.90.10CNC Shaping Machine for Wafer Carriers
A numerically controlled shaping machine that forms custom profiles on semiconductor wafer carriers and boats for cleanroom transport. This machine works by removing metal or cermets and is classified under 8461.90.10 as it is a shaping machine-tool that is numerically controlled.
8461.90.10CNC Slotter for Wafer Test Probes
A numerically controlled slotting machine that cuts precise grooves in probe cards and contacts for semiconductor wafer testing interfaces. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for slotting, and is numerically controlled.
8461.90.10CNC Wafer Edge Profiling Grinder
A numerically controlled edge grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. This machine works by removing material from semiconductor wafers and is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for grinding, and is numerically controlled.
8461.90.10Crystal Boule Grinder
A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity. It is classified under 8461.90.10 as a numerically controlled machine-tool working by removing metal or cermets, specifically for grinding.
8461.90.10Czochralski Crystal Puller
A numerically controlled machine used in semiconductor manufacturing to grow monocrystalline silicon boules by the Czochralski method, involving precise pulling and rotation of a seed crystal from molten silicon. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, and is numerically controlled.
8461.90.10DMG Mori NLX 2500/1250 CNC Planing Machine
A numerically controlled planing machine engineered for high-precision metal removal on large workpieces, specifically used to plane crystal boules before wafer slicing in semiconductor manufacturing. This machine operates by removing metal or cermets, qualifying it under tariff item 8461.90.10 for numerically controlled machine-tools.
8461.90.10DMG Mori NLX 2500 CNC Lathe
The DMG Mori NLX 2500 is a numerically controlled lathe used for turning and shaping cylindrical metal components, such as spindle shafts, in semiconductor equipment. It performs precision metal removal operations on metal or cermet materials. This machine is classified under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10Doosan Puma 2100 CNC Ingot Planer
A numerically controlled lathe-planer hybrid used for planing silicon ingot ends to exact flatness before crystal grinding in wafer production. It performs planing operations on metal or cermets, falling under tariff item 8461.90.10 for numerically controlled machine-tools.
8461.90.10Doosan Puma 2100 CNC Turning Center
The Doosan Puma 2100 is a numerically controlled twin-turret turning center that simultaneously removes metal from both ends of semiconductor vacuum chamber shafts. It works by removing metal or cermets through CNC-controlled operations. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
8461.90.10Double-Sided Wafer Polisher
A numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for polishing, and is numerically controlled.
8461.90.10Float Zone Crystal Grower
A numerically controlled apparatus employing the float zone method to produce high-purity silicon crystals by melting and reshaping a polycrystalline rod without a crucible. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, and is numerically controlled.
8461.90.10GF Machining Solutions Mikron HSM 500
The GF Machining Solutions Mikron HSM 500 is a high-speed milling CNC machine numerically controlled for complex 3D contouring of hardened metal molds used in semiconductor packaging. It removes metal and cermets through advanced toolpaths. This machine is classified under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10Haas VF-2 4-Axis CNC Mill
The Haas VF-2 is a compact 4-axis numerically controlled milling machine used for contouring and slotting metal blocks into semiconductor chamber parts. It removes material from metals and cermets via high-speed spindles. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
8461.90.10Haas VF-4 CNC Heavy-Duty Planer
A robust numerically controlled vertical planing machine for shaping large metal semiconductor components and crystal holders by removing material. This machine-tool works by removing metal or cermets, classifying it under tariff item 8461.90.10 for numerically controlled planing machines.
8461.90.10Hermle C 250 U 5-Axis CNC Machining Center
The Hermle C 250 U is a 5-axis numerically controlled machining center for complex shaping of monolithic metal blocks into semiconductor handler fixtures. It performs multi-angle metal and cermet removal. This machine is classified under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10Makino G5-A5G NC Planing Center
An advanced numerically controlled planing center for high-precision surfacing of cermet tools used in semiconductor wafer slicing saws. It removes cermet material, qualifying under tariff item 8461.90.10 for numerically controlled machine-tools for planing.
8461.90.10Makino S33 Vertical Machining Center
The Makino S33 is a numerically controlled vertical machining center designed for high-precision milling and drilling of metal parts in semiconductor manufacturing. It removes metal or cermets through CNC-controlled spindles and axes. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
8461.90.10Mazak Integrex i-200S Multi-Tasking CNC
The Mazak Integrex i-200S is a multi-tasking numerically controlled machine combining milling, turning, and drilling for complete semiconductor spindle assemblies from solid metal. It provides comprehensive metal/cermet removal capabilities. This machine is classified under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10NC Crystal Annealing Furnace Shaper
A numerically controlled shaping attachment for forming strain-free surfaces on annealed semiconductor crystals via precision grinding. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for grinding, and is numerically controlled.
8461.90.10Okamoto ACC-3224DXNC Wafer Planing Machine
A numerically controlled planing machine optimized for flattening semiconductor crystal ingots to precise diameters before grinding and slicing into wafers. It removes metal or cermets, falling under tariff item 8461.90.10 for numerically controlled planing machines.
8461.90.10Okamoto ACC-63DX CNC Surface Grinder
The Okamoto ACC-63DX is a numerically controlled surface grinder for finishing flat metal surfaces on semiconductor tooling bases to micron tolerances. It works by abrasive metal removal from cermets. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
8461.90.10Rebuilt Crystec Crystal Boule Grinder
A numerically controlled grinder, rebuilt to shape semiconductor crystal boules to precise diameters and flats indicating conductivity. It removes metal or cermets, qualifying under tariff item 8461.90.10 for numerically controlled machine-tools for planing, shaping, or other metal removal.
8461.90.10Rebuilt Disco Wafer Polisher DGP-8735
A numerically controlled polishing machine, rebuilt for final surface finishing of semiconductor wafers by controlled material removal. It works on metal or cermets, falling under tariff item 8461.90.10 for numerically controlled machine-tools for planing or other metal removal.
8461.90.10Rebuilt Giddings & Lewis CNC Planer
The rebuilt Giddings & Lewis CNC Planer is a refurbished numerically controlled gantry-type planer machine for high-precision planing of ferrous and non-ferrous metal blocks. It removes metal or cermets through CNC-controlled operations. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
8461.90.10Rebuilt Okamoto ACC-3224DX Wafer Grinder
A numerically controlled grinder, rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. It operates by removing metal or cermets, classifying it under tariff item 8461.90.10 for numerically controlled machine-tools.
8461.90.10Rebuilt Union Planer CNC Model UP Series
The rebuilt Union Planer CNC Model UP Series is a heavy-duty numerically controlled planer for planing large steel plates and cermet blocks in shipyard applications. It features high table capacity and CNC control. This machine is classified under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10Rebuilt Wafer Edge Profiling Machine
A numerically controlled machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. It works on metal or cermets, falling under tariff item 8461.90.10 for numerically controlled machine-tools for shaping or other metal removal.
8461.90.10Rebuilt Wafer Lapping Machine NTC-82S
A used numerically controlled lapping machine for flattening semiconductor wafers to optical tolerances by cermet removal. It removes metal or cermets, qualifying under tariff item 8461.90.10 for numerically controlled machine-tools for planing or other metal removal.
8461.90.10Used Brother Speedio S300X3 5-Axis Machining Center
A rebuilt 5-axis numerically controlled machining center for complex contour shaping and slotting of hard metal/cermet parts. It removes metal or cermets, falling under tariff item 8461.90.10 for numerically controlled machine-tools for shaping or other metal removal.
8461.90.10Used Cincinnati Planer-Type Milling Machine
The used Cincinnati Planer-Type Milling Machine is a rebuilt numerically controlled planer-type milling machine designed for large-scale metal planing and shaping operations in heavy industry. It removes metal or cermets through CNC-controlled operations. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
8461.90.10Used Disco DFG-7340 Wafer Slicing Saw
A rebuilt numerically controlled saw for slicing monocrystalline semiconductor boules into thin wafers by precise cutting-off of metal/cermet material. It operates by cutting-off metal or cermets, classifying it under tariff item 8461.90.10 for numerically controlled sawing machines.
8461.90.10Used DMG Mori NLX 2500 Gear Shaper
A rebuilt numerically controlled shaper for producing internal/external gear teeth by metal removal process. It removes metal or cermets, falling under tariff item 8461.90.10 for numerically controlled shaping machines.
8461.90.10Used Haas VF-2 Vertical Machining Center
A rebuilt numerically controlled vertical machining center used for milling, drilling, and shaping metal parts by removing material. It removes metal or cermets, qualifying under tariff item 8461.90.10 for numerically controlled machine-tools for shaping or other metal removal.
8461.90.10Used Mazak SmoothG CNC Gear Hobbing Machine
A rebuilt numerically controlled gear hobbing machine used to cut precise gears from metal blanks by material removal. This machine falls under tariff item 8461.90.10 as it is a machine-tool working by removing metal, specifically for gear cutting, and is numerically controlled.
8461.90.10Used Skoda HC Planing and Milling Center
The used Skoda HC Planing and Milling Center is a reconditioned numerically controlled machine combining planing and milling for complex metal surfaces. It serves energy sector turbine components. This machine is classified under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10Used TOS Varnsdorf Planing Machine
The used TOS Varnsdorf Planing Machine is a refurbished numerically controlled horizontal planing machine for heavy metal stock removal. It works on cermets and metals in automotive applications. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
8461.90.10Wade 3020 CNC Wire EDM
The Wade 3020 is a numerically controlled wire electrical discharge machine (EDM) for cutting intricate slots in hardened metal semiconductor leadframes. It removes metal through electrical erosion. This machine is classified under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
8461.90.10Yamazaki Mazak Integrex Planing Module
A modular numerically controlled planing attachment for multi-axis machining centers, used for surfacing large semiconductor crystal puller components. This attachment removes metal or cermets, classifying it under tariff item 8461.90.10 for numerically controlled planing machines.