Makino S33 Vertical Machining Center
The Makino S33 is a numerically controlled vertical machining center designed for high-precision milling and drilling of metal parts in semiconductor manufacturing. It removes metal or cermets through CNC-controlled spindles and axes. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool for metal or cermet removal.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machining center is presented as a numerically controlled milling machine
Heading 8459 covers milling machines for removing metal, which may be more specific than the residual heading 8461.
If importing parts or accessories for the machining center separately
Parts for machine-tools of heading 8461 are classified under heading 8466.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Declare the Makino S33 as a numerically controlled machining center under 8461.90.10, and provide evidence of its vertical spindle configuration
• Check if the machine qualifies for preferential duty rates under a free trade agreement by verifying its origin
• Keep the machine's programming and control documentation for CBSA verification
Related Products under Tariff item 8461.90.10
Chevalier FSG-ADV1600 CNC Grinder
The Chevalier FSG-ADV1600 is a numerically controlled double-column surface grinder engineered for precision finishing of large metal baseplates used in semiconductor cleanroom equipment. It removes material from metal or cermet workpieces to achieve the flatness tolerances critical for wafer processing environments. This machine falls under tariff item 8461.90.10 as an 'other' numerically controlled machine-tool working by removing metal or cermets.
CNC Broaching Machine for Wafer Chucks
A numerically controlled broaching machine that cuts precise keyways and slots in semiconductor wafer chucks for vacuum or electrostatic holding. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for broaching, and is numerically controlled.
CNC Shaping Machine for Wafer Carriers
A numerically controlled shaping machine that forms custom profiles on semiconductor wafer carriers and boats for cleanroom transport. This machine works by removing metal or cermets and is classified under 8461.90.10 as it is a shaping machine-tool that is numerically controlled.
CNC Slotter for Wafer Test Probes
A numerically controlled slotting machine that cuts precise grooves in probe cards and contacts for semiconductor wafer testing interfaces. It is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for slotting, and is numerically controlled.
CNC Wafer Edge Profiling Grinder
A numerically controlled edge grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. This machine works by removing material from semiconductor wafers and is classified under 8461.90.10 as a machine-tool working by removing metal or cermets, specifically for grinding, and is numerically controlled.
Crystal Boule Grinder
A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity. It is classified under 8461.90.10 as a numerically controlled machine-tool working by removing metal or cermets, specifically for grinding.