Wafer Slicing Diamond Saw from Japan
A high-precision saw that projects coolant liquid while an inner-diameter diamond blade slices semiconductor wafers from crystal boules. It is classified under this tariff item as an 'other' appliance for projecting liquids, as the coolant projection is a secondary function to the cutting operation.
Duty Rate — Japan → Canada
0%
Import Tips
• The saw's principal function is cutting, so it may be classified as a machine-tool (e.g
• 84.64 or 84.86) rather than a spraying appliance — consult CBSA
• If classified under 84.24, ensure the coolant projection is the primary function
• Verify if the saw requires any safety certifications under Canadian machinery regulations