Other
Mechanical appliances (whether or not hand-operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines. > Other appliances: > Other > Other
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8424.89.00
backside Wafer Grind Coolant Dispenser
A liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. It is a mechanical appliance for projecting liquids, falling under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids.
Conformal Coating Spray Booth for Printed Circuit Protection
An enclosed mechanical spray chamber that evenly disperses protective conformal coatings (urethane/acrylic) over assembled printed circuit boards for moisture and dust resistance. It uses HVLP precision spraying optimized for uniform coverage, making it an 'other appliance' for projecting or dispersing liquids under tariff item 8424.89.00.
Crystal Boule Grinder
A precision grinder that disperses diamond slurry or abrasive liquids to grind semiconductor crystal boules to exact diameter and flat specifications. It is classified under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids or powders.
Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, falling under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Developing Solution Spray Processor for Printed Circuits
An inline mechanical spray processor that disperses alkaline developing solutions to selectively remove unexposed photoresist from exposed printed circuit panels after UV imaging. Essential for pattern transfer in PCB manufacturing, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Dicing Street Coolant Nozzle Array
A precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. It is a mechanical appliance for projecting liquids, falling under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids.
Edge Bead Removal Spray Tool
A specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. It is a mechanical appliance for projecting liquids, falling under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids.
Etchant Spray Etching Machine for PCB Copper Layers
A high-velocity mechanical spray system projecting ferric chloride or ammonium persulfate etchants to remove unwanted copper from photoresist-patterned printed circuit boards. It includes etchant recirculation for production efficiency, classifying it under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Float Zone Crystal Grower
A specialized machine using zone melting to produce high-purity silicon crystals by projecting and manipulating molten zones along a polycrystalline rod. It falls under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids.
Flux Spraying Machine for SMT Printed Circuit Assembly
An automated mechanical sprayer that projects selective flux onto PCB pads prior to surface-mount soldering, ensuring reliable joints in high-volume assembly. Optimized for printed circuit assemblies with programmable spray patterns, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Hydrofluoric Acid Vapor Etch Sprayer
A controlled vapor sprayer that projects hydrofluoric acid vapor to remove native oxide layers from silicon wafers prior to semiconductor processing. It falls under this tariff item as an 'other' mechanical appliance for projecting, dispersing or spraying liquids or powders, not elsewhere specified in heading 84.24.
Nanoparticle Slurry Disperser for STI CMP
A high-pressure disperser that projects ceria nanoparticle slurry for shallow trench isolation (STI) chemical mechanical polishing (CMP) in semiconductor manufacturing. It is classified here as an 'other' appliance for projecting or dispersing liquids or powders, not covered by more specific headings.
Pallet Spray Conveyor for Printed Circuit Panel Processing
An automated conveyorized mechanical spray platform that transports PCB panels through multiple liquid processing stations (developer, etch, strip) using precision spray manifolds. Integrated system for high-throughput PCB processing, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Photoresist Spray Coater
A precision spray appliance that projects photoresist liquids onto semiconductor wafers to create uniform thin films for photolithography. It is classified under this tariff item as an 'other' liquid spraying appliance, as it is not a printing machine or other excluded device.
Photoresist Spray Coater for PCB Manufacturing
A mechanical appliance that precisely sprays liquid photoresist onto PCB substrates to create uniform photoresist layers essential for the photolithography process in printed circuit manufacturing. Designed solely for PCB production, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Plasma Photoresist Stripper Spray System
A mechanical spray apparatus that projects chemical strippers combined with plasma activation to remove photoresist from processed printed circuit substrates post-etching. Critical for multi-layer PCB fabrication cleanroom processes, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Semiconductor Developer Spray Apparatus
A spray system that projects alkaline developer solutions to selectively remove exposed photoresist from patterned semiconductor wafers. It falls under this tariff item as an 'other' appliance for projecting chemical liquids, not elsewhere specified in heading 84.24.
Semiconductor Wafer Polisher
A chemical mechanical polishing (CMP) tool that disperses polishing slurry to planarize semiconductor wafer surfaces for circuit fabrication. It is classified under this tariff item as an 'other' appliance for dispersing liquids, as it is not a machine-tool of Chapter 84 or a semiconductor machine of heading 84.86.
Silicon Epitaxy Gas Injector
A precision jet injector that projects precursor gases onto heated wafers for epitaxial layer growth in semiconductor devices. It is classified under this tariff item as an 'other' appliance for projecting or dispersing gases, not elsewhere specified in heading 84.24.
Solder Mask Spray Applicator for Printed Circuit Boards
A specialized spray system for uniform application of liquid solder mask onto bare PCBs, protecting copper traces during assembly. Features precision nozzles for micron-level control used principally in printed circuit assembly, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Underfill Dispensing Sprayer for BGA Printed Circuit Packages
A precision jetting system for spraying capillary underfill materials beneath BGA chips on printed circuit boards, preventing delamination during reflow. A mechanical projecting appliance designed principally for advanced PCB assembly, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Wafer Cleaning Megasonic Spray Tank
An ultrasonic spray tank that projects high-frequency cleaning solutions to remove particles from semiconductor wafers between process steps. It falls under this tariff item as an 'other' appliance for dispersing liquids, not covered by more specific headings.
Wafer Lapping Machine
A machine that projects abrasive slurry onto rotating lapping plates to achieve ultra-flat semiconductor wafer surfaces for fabrication. It is classified under this tariff item as an 'other' appliance for dispersing liquids or powders, as it is not a machine-tool of heading 84.64 or a semiconductor machine of 84.86.
Wafer Slicing Diamond Saw
A high-precision saw that projects coolant liquid while an inner-diameter diamond blade slices semiconductor wafers from crystal boules. It is classified under this tariff item as an 'other' appliance for projecting liquids, as the coolant projection is a secondary function to the cutting operation.