Wafer Slicing Diamond Saw
A high-precision saw that projects coolant liquid while an inner-diameter diamond blade slices semiconductor wafers from crystal boules. It is classified under this tariff item as an 'other' appliance for projecting liquids, as the coolant projection is a secondary function to the cutting operation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the saw is for cutting materials other than semiconductors
Machine-tools for working stone, ceramics, or similar materials are classified in 84.64.
If the saw is solely for slicing semiconductor wafers
Semiconductor manufacturing machines are classified in 84.86 per Note 11.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• The saw's principal function is cutting, so it may be classified as a machine-tool (e.g
• 84.64 or 84.86) rather than a spraying appliance — consult CBSA
• If classified under 84.24, ensure the coolant projection is the primary function
• Verify if the saw requires any safety certifications under Canadian machinery regulations
Related Products under Tariff item 8424.89.00
backside Wafer Grind Coolant Dispenser
A liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. It is a mechanical appliance for projecting liquids, falling under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids.
Conformal Coating Spray Booth for Printed Circuit Protection
An enclosed mechanical spray chamber that evenly disperses protective conformal coatings (urethane/acrylic) over assembled printed circuit boards for moisture and dust resistance. It uses HVLP precision spraying optimized for uniform coverage, making it an 'other appliance' for projecting or dispersing liquids under tariff item 8424.89.00.
Crystal Boule Grinder
A precision grinder that disperses diamond slurry or abrasive liquids to grind semiconductor crystal boules to exact diameter and flat specifications. It is classified under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids or powders.
Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, falling under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Developing Solution Spray Processor for Printed Circuits
An inline mechanical spray processor that disperses alkaline developing solutions to selectively remove unexposed photoresist from exposed printed circuit panels after UV imaging. Essential for pattern transfer in PCB manufacturing, it falls under tariff item 8424.89.00 as an 'other appliance' for projecting liquids.
Dicing Street Coolant Nozzle Array
A precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. It is a mechanical appliance for projecting liquids, falling under tariff item 8424.89.00 as an 'other appliance' for projecting or dispersing liquids.