KLA-Tencor eDR Series Electron Beam Defect Review System from China
KLA-Tencor's eDR system combines electron beam imaging with robotic wafer transport for defect review on patterned semiconductor wafers. Meets HTS 9031.80.40.00 criteria through dedicated 200mm/300mm wafer handling and EUV reticle inspection stages. Critical for yield enhancement in memory and logic device manufacturing.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide SEMI E30 GEM interface specifications and throughput data (>100 wafers/hour)
• Ensure radiation safety certifications for electron beam sources
• Pitfall: incomplete recipe files can delay customs clearance for process validation