Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles
Measuring or checking instruments, appliances and machines, not specified or included elsewhere in this chapter; profile projectors; parts and accessories thereof: > Other instruments, appliances and machines: > Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 9031.80.40.00
Hitachi EB-PageWriter Electron Beam Microscope
The Hitachi EB-PageWriter is an electron beam microscope equipped with specialized wafer handling stages and robotic arms for precise transport of semiconductor wafers during inspection. It falls under HTS 9031.80.40.00 because it is specifically designed for measuring and checking semiconductor features with integrated wafer and reticle transport systems. This configuration enables high-resolution imaging in semiconductor fabrication environments.
Applied Materials VeritySEM 10 Electron Beam Microscope
Applied Materials VeritySEM 10 features automated wafer cassette loaders and vacuum-compatible reticle stages for semiconductor metrology. Classified under HTS 9031.80.40.00 due to its specialized equipment for handling 300mm wafers and photomasks during critical dimension measurements. Essential for inline process control in advanced node fabrication.
KLA-Tencor eDR Series Electron Beam Defect Review System
KLA-Tencor's eDR system combines electron beam imaging with robotic wafer transport for defect review on patterned semiconductor wafers. Meets HTS 9031.80.40.00 criteria through dedicated 200mm/300mm wafer handling and EUV reticle inspection stages. Critical for yield enhancement in memory and logic device manufacturing.
JEOL JSX-5000SPG Electron Beam Pattern Generator
JEOL's JSX-5000SPG integrates electron beam metrology with precision reticle and wafer stage positioning systems for photomask manufacturing. Falls under HTS 9031.80.40.00 for its semiconductor-specific handling equipment enabling sub-10nm measurements. Used in mask shops for advanced patterning verification.
Thermo Fisher Helios 5 DualBeam FIB-SEM
Thermo Fisher's Helios 5 combines focused ion beam milling with electron beam imaging, featuring semiconductor lift-out grids and wafer handling for sample preparation. Classified HTS 9031.80.40.00 due to integrated transport for cross-section analysis of semiconductor devices. Essential for failure analysis and process development.
Camtek Eagle i 3D Electron Beam Metrology System
Camtek's Eagle i system provides 3D electron beam metrology with automated wafer mapping and handling for advanced packaging inspection. HTS 9031.80.40.00 classification due to cassette-to-cassette wafer transport and reticle compatibility for heterogeneous integration. Key for Cu pillar, TSV, and micro-bump metrology.