Camtek Eagle i 3D Electron Beam Metrology System from Japan
Camtek's Eagle i system provides 3D electron beam metrology with automated wafer mapping and handling for advanced packaging inspection. HTS 9031.80.40.00 classification due to cassette-to-cassette wafer transport and reticle compatibility for heterogeneous integration. Key for Cu pillar, TSV, and micro-bump metrology.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include 3D reconstruction algorithm validation against NIST standards
• Document cleanroom particle generation specs (<10 particles/ft³)
• Avoid reclassification by specifying exclusion from heading 9031.41 optical systems