Camtek Eagle i 3D Electron Beam Metrology System from China
Camtek's Eagle i system provides 3D electron beam metrology with automated wafer mapping and handling for advanced packaging inspection. HTS 9031.80.40.00 classification due to cassette-to-cassette wafer transport and reticle compatibility for heterogeneous integration. Key for Cu pillar, TSV, and micro-bump metrology.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include 3D reconstruction algorithm validation against NIST standards
• Document cleanroom particle generation specs (<10 particles/ft³)
• Avoid reclassification by specifying exclusion from heading 9031.41 optical systems