Camtek Eagle i 3D Electron Beam Metrology System from Canada
Camtek's Eagle i system provides 3D electron beam metrology with automated wafer mapping and handling for advanced packaging inspection. HTS 9031.80.40.00 classification due to cassette-to-cassette wafer transport and reticle compatibility for heterogeneous integration. Key for Cu pillar, TSV, and micro-bump metrology.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Include 3D reconstruction algorithm validation against NIST standards
• Document cleanroom particle generation specs (<10 particles/ft³)
• Avoid reclassification by specifying exclusion from heading 9031.41 optical systems