Onto Innovation Firefly NDT Wafer Defect Review System from China
High-throughput noise defect termination system for patterned wafer review using broadband plasma illumination and programmable apertures. Automates defect classification for semiconductor process control. Classified under HTS 9031.41.00.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Plasma light source safety data sheets required for import
• Defect classification algorithm export compliance documentation
• Specify fab integration interfaces (SEC/GEM) in declarations