Wafer Defect Inspection Scanner from China
An optical scanner designed to detect microscopic defects on semiconductor wafers during manufacturing. It uses laser-based imaging and AI analysis to identify particles, cracks, and pattern anomalies on silicon wafers. Classified under HTS 9031.41.0060 as an other optical instrument specifically for inspecting semiconductor wafers.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify the instrument is dedicated to semiconductor wafer inspection to avoid reclassification under general optical instruments (9013)
• Include detailed technical specs and end-use certificates to confirm compliance with Chapter 90 exclusions for machine parts
• Check for ITAR restrictions as wafer inspection tools often involve advanced optics with dual-use potential