Post-Die Singulation Inspection Scanner from Japan
Optical scanner inspecting individual semiconductor dies after wafer dicing for edge quality and contamination. High-speed imaging for pick-and-place yield optimization. HTS 9031.41.0060 for other semiconductor device optical inspection.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify die size range (from 1mm²) and sawn edge inspection capability
• Document as device inspection vs. wafer-level tool
• Include tape/frame compatibility for classification