Post-Die Singulation Inspection Scanner from China
Optical scanner inspecting individual semiconductor dies after wafer dicing for edge quality and contamination. High-speed imaging for pick-and-place yield optimization. HTS 9031.41.0060 for other semiconductor device optical inspection.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify die size range (from 1mm²) and sawn edge inspection capability
• Document as device inspection vs. wafer-level tool
• Include tape/frame compatibility for classification