Laser-Based Wafer Surface Profiler from China
Non-contact optical profiler using interferometry to measure wafer surface topography and flatness for semiconductor processing. Detects nanometer-level variations critical for chip fabrication. HTS 9031.41.0060 covers this as other optical appliance for wafer inspection.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Include metrology standards certification (e.g
• SEMI specs) for proper optical instrument classification
• Avoid describing as 'machine part' to prevent shift to heading 9033 per Chapter 90 parts rules
• Declare resolution specs (<1nm) to confirm semiconductor-specific use under 9031.41