Advanced Packaging Wafer Inspector from Germany
Optical inspection system for fan-out wafer-level packaging (FOWLP) semiconductor wafers, checking redistribution layers and underfill voids. Essential for heterogeneous integration. HTS 9031.41.0060 for other wafer optical inspection.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify packaging structure compatibility (RDL, microbumps)
• Distinguish from standard logic/memory wafer inspection
• Include 2.5D/3D packaging metrology capabilities