Advanced Packaging Wafer Inspector from Canada
Optical inspection system for fan-out wafer-level packaging (FOWLP) semiconductor wafers, checking redistribution layers and underfill voids. Essential for heterogeneous integration. HTS 9031.41.0060 for other wafer optical inspection.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify packaging structure compatibility (RDL, microbumps)
• Distinguish from standard logic/memory wafer inspection
• Include 2.5D/3D packaging metrology capabilities