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Wafer Critical Dimension SEM from Japan

Scanning electron microscope with optical pre-alignment for measuring critical dimensions on semiconductor wafers post-lithography. Though primarily electron beam, includes essential optical wafer handling and positioning. Borderline HTS 9031.41.00.40 for wafer optical components.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter

Import Tips

• Detailed optical vs electron beam functionality breakdown required for customs

• Electron gun and vacuum system components may classify separately under Chapter 85