Wafer Critical Dimension SEM from Japan
Scanning electron microscope with optical pre-alignment for measuring critical dimensions on semiconductor wafers post-lithography. Though primarily electron beam, includes essential optical wafer handling and positioning. Borderline HTS 9031.41.00.40 for wafer optical components.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Detailed optical vs electron beam functionality breakdown required for customs
• Electron gun and vacuum system components may classify separately under Chapter 85