9031.41.00.40/Wafer Critical Dimension SEM/Germany

Wafer Critical Dimension SEM from Germany

Scanning electron microscope with optical pre-alignment for measuring critical dimensions on semiconductor wafers post-lithography. Though primarily electron beam, includes essential optical wafer handling and positioning. Borderline HTS 9031.41.00.40 for wafer optical components.

Duty Rate — Germany → United States

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))

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Import Tips

• Detailed optical vs electron beam functionality breakdown required for customs

• Electron gun and vacuum system components may classify separately under Chapter 85