Laser Wafer Overlay Metrology Tool from China
Precision optical instrument measuring overlay alignment between multiple lithographic layers on semiconductor wafers. Employs interferometry and pattern recognition to ensure nanometer-level accuracy in wafer patterning processes. Falls under HTS 9031.41.00.40 for wafer-specific optical inspection in IC production.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Provide NIST-traceable calibration data for optical components to satisfy US customs metrology verification
• Label as 'for semiconductor wafer inspection only' to prevent classification under general laboratory apparatus