Laser Doppler Wafer Vibrometer from China
Non-contact laser Doppler vibrometry system measuring wafer vibration modes and chucking stability during processing. Critical for overlay improvement. Borderline HTS 9031.41.00.40 for wafer optical inspection applications.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Frequency response range (DC-20MHz) and velocity sensitivity specs required
• Prove wafer chucking application vs general vibrometry
• Risk reclassification as acoustic measurement under 9031.80