Wafer-Level Burn-in Test System from Mexico
Temperature-controlled chamber with probe cards stressing entire wafers at elevated temperatures to screen infant mortality in ICs. Monitors electrical parameters during burn-in. Classified HTS 9030.82.00.00 for semiconductor device checking.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify temperature range and electrical monitoring capabilities
• Include probe card interface specifications
• Document test pattern generator integration for proper classification