Wafer-Level Burn-in Test System from Canada
Temperature-controlled chamber with probe cards stressing entire wafers at elevated temperatures to screen infant mortality in ICs. Monitors electrical parameters during burn-in. Classified HTS 9030.82.00.00 for semiconductor device checking.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify temperature range and electrical monitoring capabilities
• Include probe card interface specifications
• Document test pattern generator integration for proper classification