Silicon Wafer Bow and Warp Metrology Tool from Germany
Capacitive and optical instrument measuring wafer bow, warp, and flatness critical for lithography alignment in IC fabrication. Supports 300mm wafers. HTS 9030.82.00.00 classification for semiconductor wafer checking.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document measurement resolution (sub-micron) and wafer diameter support for proper classification
• Include flatness standard references (SEMI M1) in import paperwork
• Avoid misclassification by specifying exclusion of general material testing applications