Silicon Wafer Bow and Warp Metrology Tool from China
Capacitive and optical instrument measuring wafer bow, warp, and flatness critical for lithography alignment in IC fabrication. Supports 300mm wafers. HTS 9030.82.00.00 classification for semiconductor wafer checking.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Document measurement resolution (sub-micron) and wafer diameter support for proper classification
• Include flatness standard references (SEMI M1) in import paperwork
• Avoid misclassification by specifying exclusion of general material testing applications