9030.82.00.00/Advanced Packaging Wafer Test Handler/Mexico

Advanced Packaging Wafer Test Handler from Mexico

Automated handler probing known good die (KGD) on wafers for 2.5D/3D IC packaging applications. Tests interposer and through-silicon via (TSV) structures. Under HTS 9030.82.00.00 for semiconductor device checking.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify TSV and interposer test capabilities in documentation

• Include multi-project wafer (MPW) handling specifications

• Document probe alignment accuracy for fine-pitch testing

Advanced Packaging Wafer Test Handler from Mexico — Import Duty Rate | HTS 9030.82.00.00