Advanced Packaging Wafer Test Handler from Mexico
Automated handler probing known good die (KGD) on wafers for 2.5D/3D IC packaging applications. Tests interposer and through-silicon via (TSV) structures. Under HTS 9030.82.00.00 for semiconductor device checking.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify TSV and interposer test capabilities in documentation
• Include multi-project wafer (MPW) handling specifications
• Document probe alignment accuracy for fine-pitch testing