Advanced Packaging Wafer Test Handler from China
Automated handler probing known good die (KGD) on wafers for 2.5D/3D IC packaging applications. Tests interposer and through-silicon via (TSV) structures. Under HTS 9030.82.00.00 for semiconductor device checking.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify TSV and interposer test capabilities in documentation
• Include multi-project wafer (MPW) handling specifications
• Document probe alignment accuracy for fine-pitch testing