3D NAND Wafer Overlay Metrology Tool from China
Advanced scatterometry tool measuring overlay accuracy between multiple 3D NAND flash memory layers on wafer. Critical for high-density memory production. HTS 9030.82.00.00 for semiconductor wafer checking instruments.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify 3D scatterometry and ellipsometry techniques used
• Include layer count capability documentation for 3D NAND
• Document sub-5nm overlay measurement resolution