Novellus (Lam Research) SPEED PVD from Japan
Novellus SPEED physical vapor deposition apparatus uses ionized metal plasma technology for advanced copper interconnect filling in semiconductor devices. Features collimation and resputtering capabilities. Classified under HTS 8543.70.20.00 for PVD.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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