Novellus (Lam Research) SPEED PVD from China
Novellus SPEED physical vapor deposition apparatus uses ionized metal plasma technology for advanced copper interconnect filling in semiconductor devices. Features collimation and resputtering capabilities. Classified under HTS 8543.70.20.00 for PVD.
Duty Rate — China → United States
40%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document IMP source technology and bottom coverage specs
• Advanced semiconductor tools face strict export controls
• Submit complete process integration requirements