Novellus (Lam Research) SPEED PVD from Canada
Novellus SPEED physical vapor deposition apparatus uses ionized metal plasma technology for advanced copper interconnect filling in semiconductor devices. Features collimation and resputtering capabilities. Classified under HTS 8543.70.20.00 for PVD.
Duty Rate — Canada → United States
12.5%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document IMP source technology and bottom coverage specs
• Advanced semiconductor tools face strict export controls
• Submit complete process integration requirements