CVC Z-400 Sputtering System from Japan
CVC Z-400 planar magnetron physical vapor deposition apparatus for semiconductor metallization layers, featuring cryogenic pumping and substrate preheat stations. Proven platform for aluminum and titanium deposition. HTS 8543.70.20.00 coverage.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify cryopump regeneration cycle documentation
• Legacy semiconductor equipment needs material safety updates
• Provide target shielding configuration details