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8543.70.20.00/CVC Z-400 Sputtering System/Japan

CVC Z-400 Sputtering System from Japan

CVC Z-400 planar magnetron physical vapor deposition apparatus for semiconductor metallization layers, featuring cryogenic pumping and substrate preheat stations. Proven platform for aluminum and titanium deposition. HTS 8543.70.20.00 coverage.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Verify cryopump regeneration cycle documentation

• Legacy semiconductor equipment needs material safety updates

• Provide target shielding configuration details

CVC Z-400 Sputtering System from Japan — Import Duty Rate | HTS 8543.70.20.00