Applied Materials Endura PVD Cluster Tool from Japan
The Applied Materials Endura is an advanced cluster tool physical vapor deposition apparatus for high-volume semiconductor manufacturing, featuring multiple process modules for metal and barrier layer deposition. It uses magnetron sputtering technology in ultra-clean vacuum environments. HTS 8543.70.20.00 specifically covers such dedicated PVD systems for electrical component fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit detailed process module specifications and cleanroom compatibility certification
• Comply with BIS export controls for semiconductor equipment
• Avoid classifying as complete production line (8486)