Applied Materials Endura PVD Cluster Tool from China
The Applied Materials Endura is an advanced cluster tool physical vapor deposition apparatus for high-volume semiconductor manufacturing, featuring multiple process modules for metal and barrier layer deposition. It uses magnetron sputtering technology in ultra-clean vacuum environments. HTS 8543.70.20.00 specifically covers such dedicated PVD systems for electrical component fabrication.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Submit detailed process module specifications and cleanroom compatibility certification
• Comply with BIS export controls for semiconductor equipment
• Avoid classifying as complete production line (8486)