Via Filling Electrolytic Cell from Mexico
Modular electrolytic cell for copper electrofilling microvias in high-density interconnect (HDI) PCBs. Features precise anode-cathode spacing for blind/buried via metallization. Classified under 8543.30.2000 for electroplating cells dedicated to printed circuit manufacture.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include HDI PCB process specifications demonstrating via diameter/filling requirements
• Document cell modular design for specific panel carrier systems used in circuit production
• Prevent reclassification by excluding general semiconductor plating applications