Of a kind used solely or principally for the manufacture of printed circuits
Electrical machines and apparatus, having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Machines and apparatus for electroplating, electrolysis or electrophoresis: > Of a kind used solely or principally for the manufacture of printed circuits
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8543.30.20.00
Anode Basket for PCB Plating Line
Titanium anode basket used in electrolytic plating baths to hold soluble anodes during copper deposition on PCB panels. Essential for uniform electroplating in high-volume circuit board production. Falls under 8543.30.2000 due to its principal and sole application in printed circuit manufacturing processes.
PCB Electroplating Rectifier Controller
Digital rectifier power supply controller optimized for pulse plating in PCB gold finger finishing processes. Provides precise current waveforms essential for high-density interconnect boards. Under 8543.30.2000 as electrical apparatus principally for printed circuit electroplating.
Solder Mask Electrophoresis Tank
Stainless steel electrophoresis tank with integrated electrodes for liquid solder mask application on PCBs. Used in final circuit protection coating processes before fabrication completion. HTS 8543.30.2000 for electrophoresis apparatus solely for printed circuit production.
Via Filling Electrolytic Cell
Modular electrolytic cell for copper electrofilling microvias in high-density interconnect (HDI) PCBs. Features precise anode-cathode spacing for blind/buried via metallization. Classified under 8543.30.2000 for electroplating cells dedicated to printed circuit manufacture.
PCB Panel Carrier Electrodes
Contact electrodes mounted on PCB panel carriers for electrolytic plating contact during panel processing. Ensures uniform current distribution across large production panels. 8543.30.2000 as electrodes principally used for printed circuit electroplating.
Pulse Plating Generator for PCBs
Programmable pulse plating generator delivering controlled current waveforms for multilayer PCB plating. Critical for achieving required deposit morphology in circuit fabrication. HTS 8543.30.2000 for electrical apparatus solely for printed circuit electroplating.
Desmear Electrolytic Etcher
Electrolytic etcher for desmear processing of drilled PCB holes prior to plating. Removes resin smear via anodic dissolution in production circuit boards. Classified 8543.30.2000 for electrolysis apparatus principally used in printed circuit manufacture.
Black Hole Copper Plating Fixture
Conductive fixture for initiating electroless copper 'black hole' activation on non-conductive PCB drill walls. Provides electrolytic strike layer for subsequent plating. 8543.30.2000 as fixture principally for printed circuit electroplating processes.
Photoresist Developer Nozzle Assembly
Precision nozzle assembly designed for dispensing liquid photoresist developer in printed circuit board (PCB) manufacturing lines. It features electrochemical-resistant materials and is used principally in electrolytic development processes for etching circuit patterns on copper-clad boards. Classified under 8543.30.2000 as it is dedicated solely to PCB production via electroplating/electrophoresis.
Electrophoretic Photoresist Coater
Apparatus applying electrophoretic photoresist coatings to PCB substrates via electric field deposition for solder mask application. Designed exclusively for multilayer circuit board fabrication. Classified in 8543.30.2000 for electrophoresis equipment used principally in printed circuit manufacture.