Via Filling Electrolytic Cell from Japan
Modular electrolytic cell for copper electrofilling microvias in high-density interconnect (HDI) PCBs. Features precise anode-cathode spacing for blind/buried via metallization. Classified under 8543.30.2000 for electroplating cells dedicated to printed circuit manufacture.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include HDI PCB process specifications demonstrating via diameter/filling requirements
• Document cell modular design for specific panel carrier systems used in circuit production
• Prevent reclassification by excluding general semiconductor plating applications