Via Filling Electrolytic Cell from Canada
Modular electrolytic cell for copper electrofilling microvias in high-density interconnect (HDI) PCBs. Features precise anode-cathode spacing for blind/buried via metallization. Classified under 8543.30.2000 for electroplating cells dedicated to printed circuit manufacture.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include HDI PCB process specifications demonstrating via diameter/filling requirements
• Document cell modular design for specific panel carrier systems used in circuit production
• Prevent reclassification by excluding general semiconductor plating applications