Photoresist Developer Nozzle Assembly from China
Precision nozzle assembly designed for dispensing liquid photoresist developer in printed circuit board (PCB) manufacturing lines. It features electrochemical-resistant materials and is used principally in electrolytic development processes for etching circuit patterns on copper-clad boards. Classified under 8543.30.2000 as it is dedicated solely to PCB production via electroplating/electrophoresis.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify the apparatus is certified for exclusive PCB electroplating use to avoid reclassification under general electrolysis equipment
• Include detailed technical specs and end-use statements in documentation proving principal use in printed circuit production