Electrophoretic Photoresist Coater from Japan
Apparatus applying electrophoretic photoresist coatings to PCB substrates via electric field deposition for solder mask application. Designed exclusively for multilayer circuit board fabrication. Classified in 8543.30.2000 for electrophoresis equipment used principally in printed circuit manufacture.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include electrophoresis process flowcharts and chemical compatibility data in import declarations
• Ensure labeling specifies 'for printed circuit boards only' to prevent challenges from general chemical equipment classifiers