Black Hole Copper Plating Fixture from Japan
Conductive fixture for initiating electroless copper 'black hole' activation on non-conductive PCB drill walls. Provides electrolytic strike layer for subsequent plating. 8543.30.2000 as fixture principally for printed circuit electroplating processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide fixture contact pin patterns matching standard panel racking systems
• Document compatibility with Pd activator chemistry used in PCB processing
• Include current density specifications for flash plating initiation