Black Hole Copper Plating Fixture from Japan
Conductive fixture for initiating electroless copper 'black hole' activation on non-conductive PCB drill walls. Provides electrolytic strike layer for subsequent plating. 8543.30.2000 as fixture principally for printed circuit electroplating processes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide fixture contact pin patterns matching standard panel racking systems
• Document compatibility with Pd activator chemistry used in PCB processing
• Include current density specifications for flash plating initiation