Black Hole Copper Plating Fixture from Japan
Conductive fixture for initiating electroless copper 'black hole' activation on non-conductive PCB drill walls. Provides electrolytic strike layer for subsequent plating. 8543.30.2000 as fixture principally for printed circuit electroplating processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide fixture contact pin patterns matching standard panel racking systems
• Document compatibility with Pd activator chemistry used in PCB processing
• Include current density specifications for flash plating initiation