8542.90.00.00/Wafer Level Chip Scale Package (WLCSP) Redistribution Layer/Japan

Wafer Level Chip Scale Package (WLCSP) Redistribution Layer from Japan

Thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. Falls under HTS 8542.90.00.00 as specialized parts of electronic integrated circuits enabling advanced fan-out packaging at wafer level.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Include RDL layer thickness and material specs (copper/PI); ESD-safe handling mandatory; declare as semiconductor WLP parts explicitly

Wafer Level Chip Scale Package (WLCSP) Redistribution Layer from Japan — Import Duty Rate | HTS 8542.90.00.00